Packaging Engineering
Packaging Engineering is an interdisciplinary domain firmly grounded in fundamental engineering principles. It traverses the realms of mechanical engineering, material science, AI, robotics, automation, electrical engineering, supply chain management, business development, as well as fostering creativity and innovation. Packaging Engineering expertise intricately intertwines with myriad industrial sectors, spanning pharmaceuticals, cosmetics, food and beverages, consumer goods, supply chain operations, and beyond. Its pervasive influence underscores its critical role in enhancing product integrity, safety, and marketability across diverse sectors.
Associated Faculty: Harold Bennet, John Blake, Martin Golden, Xi Gu, Yeubin Guo, Yogesh Jaluria, Hao Lin, Maryam Mellatdoust, Christopher Miller, Michael Pinchiaroli, Amin Reihani, Alejandro Ruiz, Patricia Santos, Guido Schmitz, Ronald Yakubison
Research Clusters
Electronic Packaging
Faculty: Yogesh Jaluria, Amin Reihani
Supply Chain Management
Faculty: Yeubin Guo