MS Thesis Defense: Muthanna Kareem, "Mechanical Characterization of Thin Film Material Melting Gel Polymeric on Silicon Wafer Substrate with Nanoindentation Measurements"

January 3, 2018

Degree of Master of Science

Mechanical Characterization of Thin Film Material Melting Gel Polymeric (Oligomeric Silsesquioxane Polymer (Tc: 120℃ ~ 170℃) on Silicon Wafer Substrate with Nanoindentation Measurements

by Muthanna K. Kareem

Thesis Director: Prof. Assimina A. Pelegri

Friday, December 8, 2017

11:00 AM

Engineering Building B-223

Nanoindentation measurements were carried out using the coatings of the Oligomeric Silsesquioxane Polymer (melting gel) (Tc: 120℃ ~ 170℃) which deposited by electrospray technology and blade on silicon wafer substrates and then heated to different temperatures in the oven for spray samples and hot plate for blade samples. Through this way, it can be possible to reach the investigating the kinetics principles of different experimental conditions which will effect on the final morphologies of melting gel films. Nanoindentation utilized to distinguish the mechanical properties of coating materials (thin film). The measurement of mechanical properties of a thin film on a hard substrate has used the technique of nanoindentation. The maximum depth of penetration in a test bounded to no more than 10% of the film thickness to avoid unintentional probing of the properties of the substrate. For this reason, it used Hysitron of Micro Materials with a diamond Berkovich indenter to evaluate the mechanical properties of thin film coating material. Reduced Young’s modulus and Hardness values extracted from measured load-displacement curves. For an exact statistical purpose, the mean values of reduced Young’s modulus and hardness quoted from the set of indentation curves, which obtained under the same parameters. The data were slightly strongly scattered due to the morphology and surface roughness of the coating thin film because the surface has shown a lot of droplets and holes typical. The results demonstrate that the substrate effects are obvious even though the penetration depth is much more than 10% of the total thickness of the thin film. The highest mechanical properties were in high heating treatments because of the melting gel property.

Committee: Prof. Pelegri  (Advisor), Prof. Singer and Prof. Mazzeo